Review and approve Materials & Processes of the Electronic parts.
Review and approve Semiconductor materials and processing.
Review and approve fabrication of Printed Wiring Boards and Printed Board Assemblies.
– Review and approve Materials & Processes PWBs based on IPC-6011, IPC-6012, IPC-A-600, etc.
– Review and approve processing of Printed Board Assemblies based on IPC J-STD-001 S/A, IPC-A-610, IPC/JEDEC J- STD-033, ANSI/ESD S-20.20, NASA-STD-8739, MIL-STD-883, MIL-STD-750, MIL-PRF-31032 /1 or /2 or MIL-PRF-55110 and Cable and Wire Harness Assemblies based on IPC/WHMA-A-620-S, MIL-W-5088, etc.
– Qualify fabrication houses.
– For degraded or failed assembly perform failure analysis to find toot cause and provide corrective actions.
