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Consulting Services

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Metallurgical Engineering - Materials Science & Engineering

    • Systematic review of the application of part.
    • Select optimal material after thorough review of Physical, Mechanical, Component Elements, Electrical, Thermal, Chemical, Optical, Processing and Descriptive properties. (Material: Metals & Alloys. Polymers, Carbon/Carbon Composites and other Non-metallic materials).
– Assure / qualify application of material to fabricate Mechanical & Structural parts, Propulsion & Thermal components, Electronics parts, Printed Wiring Boards, etc.
    • Identify MIL/FED/Industry specification for the procurement of the material. Establish private specification if required.
    • Establish applicable engineering notes and approve engineering drawing.
– Select Non-Destructive Testing (Ultrasonic, Radiographic X / Gamma Rays, Dye Penetrant, Eddy Current, Magnetic Particle, etc.) for the Material / Part to optimize quality.
  • Review and approve production process(es).
  • Certify first production part.
  • Operation Excellence Methodologies to optimize Product Quality and Return on Investment by applying Cost & Schedule Savings ideas, Lean Thinking, Six Sigma Capabilities, Statistical Problem solving, etc.
  • Train Materials and Process engineering college graduates in understanding requirements and applications.
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Process Engineering

  • Identify MIL/FED/Industry specification for the processes. Establish private process specifications if required.
  • Qualification / Application of Additive Manufacturing (3D Printing) process for printing metallic and non-metallic parts.
  • Qualification / Application of Metallurgical processes for Metal Joining (Welding, Solid State Bonding, Brazing, and Soldering) and other joining processes (Mechanical Fastening, Epoxy Bonding, etc.).
  • Qualification / Application of other Processes, Raw Material melting / Forging / Rolling / Casting, Heat Treating, Materials Testing, Non-destructive Testing, Chemical Processes (Anodize, Conversion, Passivation, Etching, Plating / Coating), Polymers Processing, Carbon-Carbon Composite Processing, etc.
  • Qualification / Application of Space Radiation Shielding process using refractory metals & alloys.
  • For the new or suspect design, if required, evaluate accelerated 4X Life testing of components based on Coffin-Manson / Weibull models.
microscope with sample illuminated from below

Failure Investigation & Analysis

    • Investigate Corrosion / Material Degradation Failures of parts and components and provide recommendations. Perform Corrosion Analysis.
    • Investigate failures of Mechanical / Structural, Propulsion, Thermal, Electronics parts and components (Material: Metals & Alloys. Polymers, Carbon/Carbon Composites and other Non-metallic materials).
– Establish Failure Investigation and Analysis Plan. – Systematic failure Analysis using Non-destructive Testing and Material / Metallurgical characterization devices (SEM/EDS, FTIR, Auger, GC-MS, XRF/XRS/XPS, Metallography/Optical Microscopy, etc. as applicable). – Find Root Cause and provide Corrective Actions.
Sample cross secton of a part with a fracture and crack

Fracture Mechanics

  • Review application and engineering drawing of the part.
  • Assure Single Point Failure of the system if applicable.
  • Establish Fracture Control Plan.
  • Review Static & Dynamic Stress Analysis (Finite Element Analysis). Identify high stress concentration area with cyclic and sustained tensile loads.
  • Identify initial flaw size (undetected based on applicable efficient non-destructive testing).
  • Perform damage tolerance analysis using NASA FLAGRO (NASGRO) software to predict safe life of the part (4X operational Life).
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Electronics

    • Review and approve Materials & Processes of the Electronic parts.
    • Review and approve Semiconductor materials and processing.
    • Review and approve fabrication of Printed Wiring Boards and Printed Board Assemblies.
– Review and approve Materials & Processes of PWBs based on IPC-6011, IPC-6012, IPC-A-600, etc.
– Review and approve processing of Printed Board Assemblies based on IPC J-STD-001 S/A, IPC-A-610, IPC/JEDEC J- STD-033, ANSI/ESD S-20.20, NASA-STD-8739, MIL-STD-883, MIL-STD-750, MIL-PRF-31032 /1 or /2 or MIL-PRF-55110 and Cable and Wire Harness Assemblies based on IPC/WHMA-A-620-S, MIL-W-5088, etc. – Qualify fabrication houses. – For degraded or failed assembly perform failure analysis to find toot cause and provide corrective actions.